Generating Electronics Cooling Improvements


Generating Electronics Cooling Improvements

Find out how simulation can mitigate risks to product life and component efficiency for different electronics cooling strategies. 


STAR-CCM+ brings detailed geometry, detailed physics and design optimization to explore performance of design variants and proving thermal reliability to achieve optimal cooling.

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The most common cooling approach for electronics is fan-driven forced convection flow. STAR-CCM+ lets you choose the best way to simulate the fan in your system – using the fan curve, with the steady-state multi-reference frame approach, or with a fully-detailed transient technique based on the rotating fan blades. This flexibility means that the needs and goals of the simulation, not the limitations of the simulation tool, determine how you choose to model the fan-driven flow.

Most thermal engineers prefer natural convection cooling for their systems, mainly because of lower implementation cost and higher reliability. For systems where natural convection might be an option, an accurate simulation is needed to properly assess the cooling performance. STAR-CCM+ contains the full set of physics to accurately model natural convection as well as the automation tools needed to rapidly explore all the design options and improve the cooling performance.

Some military, aerospace, and telecommunications applications require that electronics boards are completely sealed from the exterior environment, but this presents a challenge for the thermal design. An approach called conduction cooling is common in assemblies such as ATR chassis, and good thermal design of an ATR must balance thermal performance with weight. STAR-CCM+ provides accurate simulation of the system while enabling efficient exploration of the all design options.

Some electronics systems exceed the power density that allows an air-cooled thermal approach. Liquid cooling might then be considered in spite of additional challenges in reliability, failure protection, and system weight. So how can such a system be designed? A simulation tool is needed that can handle the complex geometry, complex physics, and wide range of design options inherent in liquid cooled systems - requirements that match the strengths of STAR-CCM+.