Discover better electronics cooling designs faster
Full detail. Complete physics. Explore all the design possibilities.
The end goal of any design is a reliable, well-performing product, yet achieving these characteristics in the design of electronics systems is a challenging endeavor. This is true whether you are designing a data center, an engine control unit, a luminaire, or an avionics chassis. A range of factors contribute to the challenge including the constant need for ever-increasing capabilities (no device is ever powerful enough), compressed design schedules (no design can be completed fast enough), and ever-decreasing sizes (no device is ever small enough) - all while avoiding a host of failure modes. One of the most common causes of mechanical failure is overheating, which can lead to performance degradation, failure of individual components, temperature cycling failure of solder joints, and reduced system lifetime. Fortunately there are a number of tools at the design engineer’s disposal to help mitigate these challenges.
Analytical calculations are particularly well-suited for broad system performance modeling and early design envelope evaluation. Physical testing is the standard for final design validation & qualification. But between these two ends of the design cycle, simulation is typically the most effective tool, allowing the engineer to efficiently explore the performance of a particular design, virtually test design variants, predict system robustness & reliability.
Better designs, faster
STAR-CCM+ is a CFD tool that will reduce uncertainty and approximation in your design process, capable of modeling any geometry, no matter how complex. Its multi-disciplinary physics modelling capabilities can simulate any cooling scenario, no matter how unconventional. STAR-CCM+ can simulate entire systems at multiple levels of fidelity. Ecooling, the STAR-CCM+ add-on for automated electronics cooling simulation workflows, and HEEDS, our Multidisciplinary Deign Exploration package, ensure that you have a no-compromise, easy-to-use, fully detailed, advanced physics simulation approach for optimizing your cooling designs.